? semiconductor components industries, llc, 2013 october, 2013 ? rev. 0 1 publication order number: mbr10100mfs/d mbr10100mfs, nrvb10100mfs switchmode power rectifiers features ? low power loss / high efficiency ? new package provides capability of inspection and probe after board mounting ? guardring for stress protection ? low forward voltage drop ? 175 c operating junction temperature ? wettable flacks option available ? nrvb prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these are pb?free devices mechanical characteristics: ? case: epoxy, molded ? epoxy meets flammability rating ul 94?0 @ 0.125 in. ? lead finish: 100% matte sn (tin) ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl 1 requirements maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v average rectified forward current (rated v r , t c = 165 c) i f(av) 10 a peak repetitive forward current, (rated v r , square wave, 20 khz, t c = 163 c) i frm 20 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 150 a storage temperature range t stg ?65 to +175 c operating junction temperature t j ?55 to +175 c unclamped inductive switching energy (10 mh inductor, non?repetitive) e as 75 mj esd rating (human body model) 3b esd rating (machine model) m4 stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. note: the heat generated must be less than the thermal conductivity from junction?to?ambient: dpd/dtj < 1/rja. device package shipping ? ordering information mbr10100mfst1g so?8 fl (pb?free) 1500 / tape & reel schottky barrier rectifiers 10 amperes 100 volts http://onsemi.com 1,2,3 5,6 so?8 fla t lead case 488aa style 2 b10100 = specific device code a = assembly location y = year w = work week zz = lot traceability marking diagram b10100 aywzz a a a not used c c 1 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbr10100mfst3g s o?8 fl (pb?free) 5000 / tape & reel nrvb10100mfst1g s o?8 fl (pb?free) 1500 / tape & reel NRVB10100MFST3G s o?8 fl (pb?free) 5000 / tape & reel
mbr10100mfs, nrvb10100mfs http://onsemi.com 2 thermal characteristics characteristic symbol typ max unit thermal resistance, junction?to?case, steady state (assumes 600 mm 2 1 oz. copper bond pad, on a fr4 board) r jc ? 1.8 c/w electrical characteristics instantaneous forward voltage (note 1) (i f = 10 amps, t j = 125 c) (i f = 10 amps, t j = 25 c) v f 0.64 0.80 0.88 0.95 v instantaneous reverse current (note 1) (rated dc voltage, t j = 125 c) (rated dc voltage, t j = 25 c) i r 4 0.003 13 0.100 ma 1. pulse test: pulse width = 300 s, duty cycle 2.0%. typical characteristics figure 1. typical instantaneous forward characteristics figure 2. maximum instantaneous forward characteristics v f , instantaneous forward voltage (v) v f , instantaneous forward voltage (v) 1.0 0.2 0 0.1 1 10 100 0.6 0.4 0.2 0 0.1 1 10 100 figure 3. typical reverse characteristics figure 4. maximum reverse characteristics v r , instantaneous reverse voltage (v) v r , instantaneous reverse voltage (v) 40 10 20 0 1.e?11 30 40 10 50 0 i f , instantaneous forward current (a) i f , instantaneous forward current (a) i r , instantaneous reverse current (a) 0.8 t a = 175 c 125 c 150 c 25 c ?40 c 0.8 1.2 t a = 175 c 125 c 150 c 25 c ?40 c 1.e?09 1.e?08 1.e?07 1.e?06 1.e?05 1.e?04 1.e?03 1.e?02 1.e?01 1.e+00 i r , instantaneous reverse current (a) t a = 175 c t a = 150 c t a = 125 c t a = 25 c t a = ?40 c t a = 175 c t a = 150 c t a = 125 c t a = 25 c t a = ?40 c 1.e?11 1.e?08 1.e?07 1.e?06 1.e?05 1.e?04 1.e?03 1.e?02 1.e?01 1.e+00 0.4 50 70 30 70 20 0.6 1.0 60 80 90 100 1.e?10 60 80 100 90 1.e?09 1.e?10
mbr10100mfs, nrvb10100mfs http://onsemi.com 3 typical characteristics 0 2 4 6 8 10 12 14 16 18 60 80 100 120 140 160 180 figure 5. typical junction capacitance figure 6. current derating to?220ab v r , reverse voltage (v) t c , case temperature ( c) 30 40 10 60 0 10 100 1,000 figure 7. forward power dissipation i f(av) , average forward current (a) 4 3 2 1 0 0 1 2 3 5 6 7 8 figure 8. thermal response pulse time (sec) 0.01 0.001 10 0.0001 100 0.00001 1,000 0.000001 0.001 0.01 0.1 1 10 100 c, junction capacitance (pf) i f(av) , average forward current (a) p f(av) , average forward pow- er dissipation (w) r(t) ( c/w) t j = 25 c r jc = 1.8 c/w square wave dc t j = 175 c 4 square wave dc i pk /i av = 20 i pk /i av = 10 i pk /i av = 5 1 0.1 single pulse 50% duty cycle 20% 10% 5% 2% 1% assumes 25 c ambient and soldered to a 600 mm 2 ? oz copper pad on pcb 80 20 50 70 90 100
mbr10100mfs, nrvb10100mfs http://onsemi.com 4 package dimensions m 3.00 3.40 0 ??? 3.80 12 dfn5 5x6, 1.27p (so?8fl) case 488aa issue h notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeter. 3. dimension d1 and e1 do not include mold flash protrusions or gate burrs. 1234 top view side view bottom view d1 e1 d e 2 2 b a 0.20 c 0.20 c 2 x 2 x dim min nom millimeters a 0.90 1.00 a1 0.00 ??? b 0.33 0.41 c 0.23 0.28 d 5.15 bsc d1 4.70 4.90 d2 3.80 4.00 e 6.15 bsc e1 5.70 5.90 e2 3.45 3.65 e 1.27 bsc g 0.51 0.61 k 1.20 1.35 l 0.51 0.61 l1 0.05 0.17 a 0.10 c 0.10 c detail a 14 l1 e/2 8x d2 g e2 k b a 0.10 b c 0.05 c l detail a a1 e 3 x c 4 x c seating plane max 1.10 0.05 0.51 0.33 5.10 4.20 6.10 3.85 0.71 1.50 0.71 0.20 m *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1.270 2x 0.750 1.000 0.905 0.475 4.530 1.530 4.560 0.495 3.200 1.330 0.965 2x 2x 3x 4x 4x pin 5 (exposed pad) style 2: pin 1. anode 2. anode 3. anode 4. no connect 5. cathode on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mbr10100mfs/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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